基本信息

書名：集成電路封裝材料的錶徵

定價：98.00元

作者：(美)布倫德爾,(美)埃文斯,(美)摩爾

齣版社：哈爾濱工業大學齣版社

齣版日期：2014-01-01

ISBN：9787560342825

字數：

頁碼：

版次：1

裝幀：平裝

開本：16開

商品重量：0.4kg

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內容提要

《集成電路封裝材料的錶徵(英文)》的主要內容包括： Foreword；Preface to the Reissue of the Materials Characterization Series xiii；Preface to Series xiv；Preface to the Reissue of Integrated Circuit Packaging Materials xv；Preface xvi；Contributors xix等。

目錄

作者介紹

Thomas M. Moore and Robert G. McKennaForeword by Walter H. Schroen， TI FELLOWCharacterization of Integrated Circuit Packaging Materials deals with the systemsof materials that prise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniquesappropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technologicalproblems of IC packages. This book discusses issues which affect a varietyof package types， including plastic surface—mount packages， hermetic packages， and advanced designs such as flip—chip， chip—on—board， and multi—chipmodels.

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