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適讀人群 :機械、電子、傢電等部門從事金屬材料精密連接技術工作的科研、生産技術人員 《釺焊手冊》從初版起就對我國的釺焊有很大的影響。印象深的是有一年我們在天津的一個焊接展覽會上展賣焊接圖書,《釺焊手冊》受到釺焊企業技術人員的好評,到後一天我們打包撤展瞭,在把一捆捆的書往車上搬時,還有人追來問還有沒有《釺焊手冊》瞭。
《釺焊手冊》的第2版時我聽說美國的“Brazing Handbook”和“Soldering Handbook”在修訂時也參考瞭我們的《釺焊手冊》。
現在《釺焊手冊》第3版齣版瞭,這是在前兩版的基礎上①補充釺焊領域進展的新資料;②增加必要的新內容;③對某些章節進行重寫。這次修訂編寫的原則:①重實踐,豐富資料數據;②重視國內外有關參考文獻的引用,作為瞭解有關內容的進一步延伸;③盡可能描述實踐和操作,使實際工作者得以從中獲取有用的資料和經驗。相信《釺焊手冊》第3版能給廣大從事釺焊與精密連接工作的讀者帶來更技術盛宴。
內容簡介
《釺焊手冊》是一本應用理論和實際工作經驗總結並重的工具書。全書以被釺焊的母材為主綫進行敘述:對鋁、銅、鋼、不銹鋼、高溫耐熱閤金、難熔金屬、鈦、鋯、鈹、鎂、硬質閤金、碳、金剛石、半導體、陶瓷、貴金屬、復閤材料、特種材料的釺焊,包括部分材料的軟釺焊都進行瞭詳盡的介紹。參加本手冊每一章編寫的作者,都是在該領域中有多年工作經驗和科研成果的專傢和技術人員,他們在第2版的基礎上,收集瞭大量的資料,進行瞭修訂或重寫,因此本書內容有一定的深度和廣度。書中還加強瞭應用理論的闡述,特彆是在第1章緒論中將界麵傳質理論通俗地引入釺焊領域,並用以闡明和控製釺焊過程,有較新的意義。
目錄
目錄
Contents
第3版前言Preface of the Third Edition
第2版前言Preface of the Second Edition
第1版前言Preface of the First Edition
第1章緒論Chapter 1 Introduction1
1.1釺焊方法的原理和特點Principle and Characteristic of Brazing and Soldering Technique1
1.2熔態釺料對固體母材的潤濕和鋪展Wetting and Spreading of Molten Filler Metal on a Solid Base Metal1
1.2.1固體金屬的錶麵結構The Surface Structure of Solid Metal1
1.2.2熔態釺料與固體母材的潤濕Wetting of Molten Filler on Solid Base Metal2
1.2.3熔態釺料在釺劑(第二液體)中與母材間界麵張力的變化Change of Interfacial Tension between Molten Filler and Base Metal Immersed in a Fused Flux(a second liquid)4
1.2.4金屬母材錶麵的氧化膜及其去除機製Oxide Film on Base Metal and its Removal Mechanism6
1.2.5熔態釺料在固體母材上的鋪展Spreading of Molten Filler Metal on Solid Base Metal7
1.3熔態釺料與固體母材的相互作用Reaction of Molten Filler with Solid Base Metal9
1.3.1熔態金屬與固體金屬的相互作用Reaction of Molten Metal with Solid Metal9
1.3.2釺料的構成Construction of Filler Metals11
1.3.3熔態釺料在母材間隙中的流動和釺縫結構的不均勻性Flowing of Molten Filler Metal in the Clearance of Base Metals as well as Inhomogeneity of the Formed Fillet14
1.3.4熔析與熔蝕Liquation and Erosion15
1.4釺縫中熔態釺料的凝固和釺縫的金相組織Solidification of Molten Filler Metal in Clearance and the Micrographic Structure of the Fillet16
1.4.1共晶釺縫組織The Structure of Eutectic Fillet16
1.4.2晶間滲透組織The Fillet Structure with Intercrystalline Penetration16
1.4.3有化閤物生成的釺縫組織The Fillet Structure with Intermetallics17
1.5釺劑、釺料的選擇與搭配Selection and Matching of Fluxes with Filler Metals18
1.5.1釺劑的選擇Selection of Fluxes18
1.5.2釺料的選擇Selection of Filler Metals20
1.5.3釺劑和釺料的搭配Matching of Filler Metal with Flux21
1.6釺焊工藝Technology of Brazing and Soldering21
1.6.1接頭的形式與釺料在釺縫中的流動性Joint Types and Flowability of Molten Filler Metal in the Clearance21
1.6.2加熱方法Methods for Heating22
1.6.3工件的升溫速度和冷卻速度Heating and Cooling Rate of Workpieces in Brazing Process23
1.6.4釺焊接頭的保溫處理和結構的彌散Annealing for Brazed Joints and Structure Dispersion in the Fillet23
參考文獻References25
第2章鋁及鋁閤金的釺焊Chapter 2 Brazing and Soldering of Aluminum and its Alloys27
2.1概述Introduction27
2.2鋁及鋁閤金的編號Designations of Aluminum and its Alloys27
2.3鋁及鋁閤金的理化性能Physical and Chemical Properties of Aluminum and its Alloys28
2.3.1鋁及鋁閤金的物理性能Physical Properties of Aluminum and its Alloys28
2.3.2鋁及鋁閤金的化學性能Chemical Properties of Aluminum and its Alloys39
2.4鋁氧化膜的本質及其在加熱時的變化Nature of Oxide Film on Aluminum and its Change during Heating40
2.5鋁釺劑Fluxes for Aluminum Brazing and Soldering41
2.5.1鋁的硬釺劑Fluxes for Aluminum Brazing41
2.5.2鋁的軟釺劑Fluxes for Aluminum Soldering53
2.6釺焊時鋁氧化膜的脫除機製Removal Mechanism of Oxide Film on Aluminum during Brazing55
2.6.1鋁氧化膜與熔鹽釺劑的相互作用Interaction of Oxide Film on Aluminum with Molten Salt Flux55
2.6.2真空環境下金屬蒸氣對鋁氧化膜的破壞Disruption of Oxide Film on Aluminum by Metal Vapor in Vacuum Environment57
2.7鋁釺料Brazing Filler Metals and Solders for Aluminum Alloys58
2.7.1Al-Si係釺料(液相綫溫度範圍570~630°C)Filler Metals of Al-Si Series(melting range 570~630°C)58
2.7.2Al-Si-Cu-Zn係釺料(液相綫溫度範圍500~577°C)Filler Metals of Al-Si-Cu-Zn Series(melting range 500~577°C)60
2.7.3Al-Cu-Ag-Zn係釺料(液相綫溫度範圍400~500°C)Filler Metals of Al-Cu-Ag-Zn Series(melting range 400~500°C)61
2.7.4Al-Ge-Si係釺料(液相綫溫度範圍425~500°C)Filler Metals of Al-Ge-Si Series (melting range 425~500°C)61
2.7.5Zn-Al係釺料(液相綫溫度範圍382~400°C)Solders of Zn-Al Series(melting range 382~400°C)62
2.7.6Cd-Zn係釺料(液相綫溫度範圍265~350°C)Solders of Cd-Zn Series(melting range 265~350°C)64
2.7.7Sn-Zn係釺料(液相綫溫度範圍198~260°C)Solders of Sn-Zn Series(melting range 198~260°C)64
2.7.8Sn-Pb係釺料(液相綫溫度範圍183~270°C)Solders of Sn-Pb Series(melting range 183~270°C)65
2.7.9Pb-Bi係釺料(液相綫溫度範圍124~200°C)Solders of Pb-Bi Series(melting range 124~200°C)66
2.8鋁的復閤釺焊材料Composite Fillers for Aluminum Brazing or Soldering66
2.8.1鋁釺焊闆Aluminum Brazing Sheets66
2.8.2藥芯及藥皮鋁釺焊絲Flux Cored and Flux Coated Filler Metals for Aluminum Brazing or Soldering67
2.8.3釺料-釺劑粉燒結的復閤鋁釺焊條(絲)Composites of Sintered Powder Filler Metals with Flux for Aluminum Brazing68
2.8.4鋁釺料膏Aluminum Brazing Paste68
2.9鋁釺焊中的一些特殊技藝Some Special Skills in Aluminum Brazing and Soldering68
2.9.1用金屬鎵來作為界麵活性劑進行鋁閤金零件的精密擴散釺焊Gallium Used as a Surfactant for Precise Soldering of Aluminum Alloy Parts68
2.9.2用鍺粉進行鋁閤金的無釺劑擴散釺焊Fluxless Diffusion Brazing of Aluminum Alloys with Germanium Powders69
2.9.3鋁及鋁閤金的錶麵軟釺焊釺塗改性Surface Modification of Aluminum Alloys by Solder-coating69
2.9.4鋁的自釺軟釺劑Self-soldering Flux Used for Soldering Aluminum Alloy Parts69
2.9.5鋁閤金麵上敷以Nocolok釺劑-矽粉-閤成樹脂復閤塗層A Composite Coating on Aluminum Alloys Made by Resinized Silicon and Nocolok Flux70
2.10鋁釺焊的焊前準備和焊後處理Pre-brazing Preparations and Post-brazing Operations70
2.10.1接頭和夾具的設計Joint and Jig Design70
2.10.2工件的預清洗Pre-cleaning of Workpieces to be Brazed72
2.10.3工件焊後的清洗Post-braze Cleaning of Workpieces74
2.10.4鍍覆Finishing75
參考文獻References76
第3章銅和銅閤金的釺焊Chapter 3 Brazing and Soldering of Copper and Copper Alloys80
3.1概述Introduction80
3.2釺焊性Brazability and Solderability84
3.2.1純銅Copper84
3.2.2普通黃銅Brasses84
3.2.3锡黃銅Tin Brasses84
3.2.4鉛黃銅Leaded Brasses84
3.2.5錳黃銅Manganese Brasses84
3.2.6锡青銅Tin Bronzes84
3.2.7鋁青銅Aluminum Bronzes84
3.2.8鈹銅Beryllium Copper85
3.2.9矽青銅Silicon Bronzes85
3.2.10鉻銅和鎘銅Chromium Copper and Cadmium Copper85
3.2.11白銅閤金Copper-nickel Alloys85
3.3釺焊接頭間隙Clearance of Brazed Joint85
3.4軟釺料Solders88
3.4.1鎵基釺料Gallium Based Solders88
3.4.2鉍基釺料Bismuth Based Solders89
3.4.3銦基釺料Indium Based Solders89
3.4.4锡鉛釺料Tin Lead Solders89
3.4.5無鉛釺料Lead Free Solders94
3.4.6高溫锡釺料High Temperature Tin Solders106
3.4.7鉛基釺料Lead Based Solders107
3.4.8鎘基釺料Cadmium Based Solders107
3.4.9金基軟釺料Gold Based Solders108
3.5硬釺料Brazing Filler Metals108
3.5.1對釺料的基本要求Demands on Brazing Filler Metals108
3.5.2釺料的分類Classification of Brazing Filler Metals108
3.5.3釺料的型號與牌號Designations of Brazing Filler Metals108
3.5.4銀釺料Silver Filler Metals109
3.5.5低銀釺料Low Silver Based Filler Metals123
3.5.6銅磷釺料Copper-phosphorus Filler Metals130
3.6釺劑Fluxes135
3.6.1釺劑的功能Functions of Brazing Fluxes135
3.6.2對釺劑的基本要求Demands on Brazing Fluxes135
3.6.3釺劑的分類及型號Classification and Type of Fluxes136
3.7軟釺劑Soldering Fluxes136
3.7.1腐蝕性釺劑Corrosive Fluxes137
3.7.2弱腐蝕性釺劑Medial Corrosive Fluxes138
3.7.3無腐蝕性釺劑Non-corrosive Fluxes139
3.8硬釺劑Brazing Fluxes140
3.9錶麵準備Surface Preparation143
3.10接頭設計Joint Design143
3.11釺焊方法和工藝Methods and Technology of Soldering and Brazing144
3.11.1銅Copper144
3.11.2黃銅Brasses144
3.11.3銅和黃銅軟釺焊接頭強度The Strength of Copper and Brass Soldered Joints144
3.11.4錳黃銅Manganese Brasses147
3.11.5鈹銅Beryllium Copper148
3.11.6鉻銅Chromium Copper148
3.11.7鎘銅和锡青銅Cadmium Copper and Tin Bronzes148
3.11.8矽青銅Silicon Bronzes148
3.11.9鋁青銅Aluminum Bronzes148
3.11.10鋅白銅和錳白銅Copper-nickel Alloys149
參考文獻References149
第4章電子工業中的軟釺焊Chapter 4 Soldering in Electronic Industry151
4.1電子製造與軟釺焊Electronic Manufacture and Soldering151
4.1.1軟釺焊在電子工業中的地位The Position of Soldering Technique in Electronic Industry151
4.1.2電子製造與電子封裝Electronic Manufacture and Electronic Packaging151
4.1.3電子工業中釺焊連接的特點及發展曆程The Characteristic and Development Course of Soldering Technique in Electronic Industry152
4.2軟釺焊連接的基本原理Fundamental of Soldering154
4.2.1軟釺焊的定義Definition of Soldering154
4.2.2釺料與母材間的相互作用Interaction Between Solder and Base
前言/序言
《釺焊手冊》第1版1999年問世,9年後的2008年齣版瞭第2版,如今是2017年,距離第2版齣版又是9年過去瞭。值得全體編者欣慰的是,這本手冊無論是在釺焊研究領域還是在實際生産中都起到瞭良好的作用,在發錶的科研論文上有較高的引用率。鑒於此,機械工業齣版社有意延續這本手冊的思路,修訂齣版第3版。
這本《釺焊手冊》廣泛集閤瞭國內許多學校、研究機構和生産單位的學者、專傢和工程師,共同打造齣這樣一個平颱,列齣瞭與釺焊材料有關的物理、化學和力學性能的資料數據,闡述瞭釺焊材料的構成和釺焊的工藝過程,介紹瞭和釺焊有關的原理、工作機製以及世界釺焊領域內研究的最新進展。特彆是編者們還毫無保留地貢獻齣瞭自己多年來的研究心得和釺焊的生産經驗。因此這本《釺焊手冊》
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