超大规模集成电路布线技术(新视野电子电气科技丛书)

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[美] Venky,Ramachandran,[美] Pinaki,Ma 著
图书标签:
  • 集成电路
  • 布线
  • 超大规模集成电路
  • VLSI
  • 电子设计自动化
  • EDA
  • 芯片设计
  • 物理设计
  • 半导体
  • 新视野电子电气科技丛书
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出版社: 清华大学出版社
ISBN:9787302478386
版次:1
商品编码:12344663
包装:精装
开本:16开
出版时间:2018-03-01
用纸:胶版纸
页数:333
字数:496000

具体描述

内容简介

本书作者Pinaki Mazumder教授是IEEE Fellow和AAAS Fellow,在EDA领域有30年以上的教学、科研和工程经历。

本书汇集电子设计自动化领域包括作者在内的研究者的*新成果,聚焦超大规模集成电路布线技术,从串行与并行布线模型开始,到各种基本布线算法,兼顾芯片设计中的特定情况,重点讨论了大量的工业界实用的特殊类型布线与*新并行布线器。

本书注重基础,主要研究迷宫布线算法、总体布线算法、详细布线算法(即通道布线与开关盒布线算法等)和特殊布线算法,具有较高的通用性和实用性,有望推动超大规模集成电路布线工具的持续发展。

本书既涉及EDA领域“大家”的重要成果,也涵盖作者及其团队30多年的杰出研究,适合计算机与半导体行业从业的工程师、电子设计自动化方面的教学者阅读,也适合研究VLSI电路布局布线算法的高年级硕士生、博士生以及研究学者参考。


前言/序言

PREFACE


This handbook for routing interconnects inside a VLSI chip provides mathematical models of important classes of wiring techniques for students interested in gaining insights in integrated circuits layout automation techniques and for practicing engineers working in the field of electronic design automation (EDA). This book presents a comprehensive review on VLSI routing techniques that was undertaken in early 1990�餾 with a view to developing a generalized routing accelerator that could speed up routing chores for different styles of wiring techniques, namely, maze routing used widely for connecting different circuit blocks by finding the shortest path, channel routing used in connecting standard cells of uniform heights and variable widths arranged in the form of rows of cells, switchbox routing used in connecting surrounding multiple blocks of dissimilar aspect ratios within an enclosed routing area, and so on.

In 1988, when I started my academic career at the University of Michigan, I designed a new graduate�瞝evel course on computer�瞐ided design, EECS 527: VLSI Layout Algorithms. The course was introduced to educate graduate students and spur doctoral research in the�瞭hen burgeoning field of computer�瞐ided design (CAD) for integrated circuits (ICs) that propelled the exponential growth of integration density in VLSI chips, as postulated by Moore�餾 Law. At that time, there was no suitable textbook on the subject to teach graduate students about the state�瞣f�瞭he�瞐rt layout algorithms that were key to design complex VLSI chips. Therefore, I combed through the literature on the subject and assembled the course materials in order to teach students systematically basic underlying mathematical techniques for circuit partitioning, floor�瞤lanning, cell placement, and routing. Subsequently, I engaged my own doctoral students to expand my lecture materials in the form of comprehensive reviews.

For example, with the assistance of my doctoral student, Dr. K. Shahookar, who studied the Genetic Algorithm (GA) for VLSI cell placement techniques, I coauthored a 78�瞤age review paper, which was published in ACM Computing Surveys in June 1991. After poring over nearly a hundred publications on placement algorithms for standard cells and macro�瞔ells, I divided them into five main categories: (i) the placement by simulated annealing, (ii) the force�瞕irected placement, (iii) the placement by min�瞔ut graph algorithms, (iv) the placement by numerical optimization, and (v) the evolution�瞓ased placement. While the first two types of algorithms owe their origin to physical laws, the third and fourth are analytical techniques, and the fifth class of algorithms is derived from biological phenomena. The taxonomy of placement algorithms was created to study inherent parallelism of the different classes of algorithms. While designing the course, I realized that in order to push the mammoth potential of Moore�餾 Law, the chip design phase must be accelerated several folds by harnessing the evolving computing platforms.

In the late 80�餾, the computing platforms for the VLSI design environment were rapidly transforming from mid�瞗rame computers, namely, Digital Equipment Corporation Vax 11/780, Hewlett Packard HP 3000, and Wang Laboratories Wang VS, to the network of workstations, what is widely known as the NOW. This opportunity in hardware evolution warranted deeper insights into VLSI cell placement and routing (P&R;) techniques so that sequential algorithms that used to run on standalone mid�瞗rame computers could be rendered into parallel CAD algorithms for running efficiently on the NOW platform. Also, emergence of commercial parallel computers such as Intel hypercube and Sequent Computer System shared memory had further pushed the needs for developing parallel P&R; algorithms.

In order to promote the NOW platform for EDA research, I started working with my students to develop imaginative distributed Genetic Algorithms (GAs) for partitioning, placement and floor�瞤lanning techniques needed in VLSI chip layout automation. My research group had at that time developed an EDA tool, named Wolverines for parallel implementation of standard cell placement algorithms on the NOW platform. Since workstations are connected by a local area network (LAN) that often deploys the Ethernet to connect different workstations, communication of packets between two specific workstations generally require considerable time even when the Ethernet did not undergo collision of message packets. Because of the length of a LAN, two workstations located afar may locally sense and infer that the Ethernet is free and may launch packets asynchronously. In case, there is a collision of packets, all the senders must abandon transmission by backing off. Then they wait randomly within the range of time before attempting to transmit the packet. If a sender encounters the collision of packet again, it then waits randomly over a period of time that is twice longer than the previous time period. This exponential backing off protocol used in random�瞐ccess LAN causes a severe constraint to run parallel routing algorithms because of their fine�瞘ranularity of parallelism in contrast with placement algorithms that do not require frequent communications in parallel mode of operation over the NOW.

After realizing the key limitations of such dedicated routing accelerators that could only speed up the maze routing, my student, Dr. V. Ramachandran, who is the coauthor of this book, started looking into the possibility of developing a unified routing fabric that can be utilized to accelerate all sorts of VLSI routing algorithms. In his doctoral work, he proposed a polymorphic architecture that mainly comprises an ensemble of simple processing elements that can be configured into various connection topologies by including a suite of switches in each processing element. The highly parallel single instruction multiple data (SIMD) architecture is generally known as Content Addressable Array Parallel Processor (CAAPP) and has been originally developed for image processing applications. Specifically, Dr. Ramachandran had used the CAAPP software framework to experiment with the virtual polymorphic hardware fabric, on which different types of routing algorithms including maze, channel and switchbox were mapped as reported in Section 5.3 in this book.

My overall vision in EDA was to develop distributed networks of workstations furnished with specialized hardware accelerator board containing the polymorphic chip to accelerate different styles of VLSI routing algorithms, while Genetic Algorithms will speed up the cell placement algorithms. Due to funding constraints, in our research group we could fabricate a tiny proof of concept polymorphic chip as shown below. The purpose of this handbook is not only to introduce different styles of VLSI routing algorithms, but also to exposit the ramifications of hardware�瞫oftware co�瞕esign for such fine�瞘rained parallel algorithms over a polymorphic fabric so that various types of chip routing algorithms can be accelerated, while the placement and floor�瞤lanning algorithms will be speeded up by leveraging the intrinsic parallelism of genetic algorithms. With this vision in mind, I hope that readers will be motivated to advance the frontiers of VLSI chip design through innovating hardware�瞫oftware co�瞕esign methods as espoused in this routing handbook.

Pinaki Mazumder, Professor


Fellow of the IEEE & Fellow of the AAAS


Dept. of Elec. Eng. and Comp. Sci.


University of Michigan, Ann Arbor, USA


July 25, 2017



《摩尔定律的终结与硅基极限:超越当前VLSI布线技术的未来图景》 作者: (此处为书籍作者姓名,若无,可虚构一位在集成电路领域享有盛誉的学者,例如:王明教授) 出版社: (此处为书籍出版社名称,可虚构一家专业的科技出版社,例如:科技前沿出版社) 系列: (此处为书籍系列名称,可虚构一个前沿系列,例如:未来芯片研究丛刊) 内容梗概: 《摩尔定律的终结与硅基极限:超越当前VLSI布线技术的未来图景》一书,并非一本介绍当前超大规模集成电路(VLSI)布线技术的“技术手册”,而是将目光投向了更加宏远和深刻的未来。它深入探讨了随着摩尔定律日益逼近物理极限,以及传统硅基CMOS技术面临的根本性挑战,未来的集成电路设计和制造将如何演进。本书旨在勾勒出一条超越当前布线技术范式的、探索全新信息处理范式和材料体系的宏大图景,为那些对集成电路未来发展抱有强烈好奇心的读者,尤其是资深的工程师、研究人员和科技政策制定者,提供一个前瞻性的思考框架。 本书并非从“如何布线”这个具体的技术层面切入,而是从“为何需要超越现有布线”的根本性问题出发。作者首先对当前VLSI布线技术所处的瓶颈进行了深刻的剖析。虽然当前的技术在精密度、集成度和性能上取得了令人瞩目的成就,但随着晶体管尺寸的不断缩小,互连线间的寄生效应(如电容、电阻、串扰)问题变得愈发突出,成为限制芯片性能提升的关键因素。电流密度过大导致的可靠性问题(如电迁移)以及功耗的持续攀升,也使得传统二维或有限层数的布线方式难以为继。作者将带领读者一同审视这些“剪不断理还乱”的布线难题,并非为了提供现成的解决方案,而是为了揭示其背后蕴含的物理学和工程学的根本限制。 在此基础上,本书将视角拓展至“摩尔定律的终结”这一历史性转折。作者认为,单纯依靠技术进步来维持性能倍增的模式正面临前所未有的压力。这并非意味着集成电路的发展就此停滞,而是预示着一个新时代的到来。这个新时代将不再是“更快、更小”的线性叙事,而是需要颠覆性的创新,尤其是在信息处理架构和实现技术上。本书将回顾摩尔定律的辉煌历程,并深入分析其终结的物理根源和经济驱动因素。这不是一次对过去的缅怀,而是为了更好地理解未来的方向。 《摩尔定律的终结与硅基极限》的核心在于探索“硅基极限”下的可能性。作者并不回避硅基CMOS技术在未来可能面临的根本性物理限制,例如量子隧穿效应、功耗密度过高以及材料本身的物理特性。然而,他并非因此宣告硅基时代的结束,而是强调在“硅基”这个大概念下,仍然存在着巨大的创新空间。这包括但不限于: 三维(3D)集成与异构集成: 随着二维平面布线空间的饱和,将计算单元和存储单元堆叠起来,形成三维芯片,成为突破性能瓶颈的必然选择。本书将详细探讨3D TSV(硅通孔)技术、2.5D封装技术,以及更具颠覆性的全三维(Full 3D)芯片架构的可能性。这些技术不仅能够大幅缩短互连距离,降低功耗,还为将不同工艺、不同功能的芯片“像乐高积木一样”组合起来提供了可能,从而实现前所未有的异构计算能力。作者会深入分析三维布线带来的全新挑战,例如热管理、良率控制以及信号完整性问题,并展望未来的三维互连材料和设计工具的演进。 超越CMOS的器件技术: 除了传统的CMOS晶体管,本书将聚焦那些有望克服现有硅基器件局限的“后CMOS”技术。这包括了碳纳米管晶体管、二维材料(如石墨烯、过渡金属二硫化物)晶体管、自旋电子器件(Spintronics)、铁电材料器件(Ferroelectrics)、相变存储器(PCM)等。作者将详细介绍这些新型器件的工作原理、潜在优势以及它们在实现高密度、低功耗、高性能计算方面的可能性。特别地,本书将探讨这些新型器件如何在微观层面改变布线的设计理念,例如如何与新型互连材料协同工作,或者是否能集成更多的逻辑功能到器件本身,从而减少对传统布线的依赖。 新型互连材料与技术: 随着导线尺寸越来越小,金属的电阻率问题愈发严重。本书将深入探讨石墨烯、碳纳米管、二维金属等新型导电材料在未来芯片互连中的应用潜力。这些材料有望实现超低电阻和高电流密度承载能力,从而大幅提升芯片的速度和可靠性。此外,本书还将关注光学互连(Optical Interconnect)的可能性,它有望在芯片内部或芯片之间实现极高的带宽和极低的延迟,成为克服电互连瓶颈的终极解决方案之一。作者会分析光学互连的挑战,例如光电转换效率、光波导的制造精度以及与电子电路的集成难度。 新型计算范式: 面对未来计算需求的爆炸式增长,特别是人工智能、大数据分析等应用,传统的冯·诺依曼架构及其基于CMOS的实现方式可能已不再是最佳选择。本书将探讨走向“后摩尔定律时代”的新计算范式,例如存内计算(In-Memory Computing)、神经形态计算(Neuromorphic Computing)、量子计算(Quantum Computing)以及生物计算(Biological Computing)等。作者将分析这些新型计算范式如何从根本上改变对硬件的需求,包括对布线密度、速度、功耗以及信息存储和处理方式的全新要求。例如,存内计算将存储与计算单元集成,大幅减少数据搬运的延迟,其布线设计将与传统芯片截然不同。神经形态计算则模仿人脑的结构和功能,对硬件的并行处理和低功耗特性提出了极高要求。 《摩尔定律的终结与硅基极限》的独特之处在于,它并非沉溺于具体的工程细节,而是聚焦于趋势、挑战和可能性。作者将以批判性的视角审视当前的研究热点,区分炒作与实质,并引导读者理解不同技术路线之间的协同与竞争关系。本书不会提供“如何设计一个三维芯片”的步骤,但会深刻阐释“为何需要三维芯片”以及“未来的三维芯片会是怎样的”。它旨在激发读者关于集成电路未来发展的深刻思考,鼓励跨学科的合作,并为应对未来计算领域的巨大挑战指明方向。 本书的语言风格力求严谨而富于启发性,避免了枯燥的技术堆砌,而是通过清晰的逻辑、生动的比喻以及对未来发展趋势的深入洞察,展现出集成电路领域令人兴奋的未来前景。它适合所有对集成电路的底层原理、发展瓶颈以及未来方向感到好奇的人士阅读,希望能够为推动下一代信息技术的创新贡献一份力量。这本书将是一次对集成电路“下一章”的深刻解读,一次对“硅基极限”之下无限可能的探索。

用户评价

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这本《超大规模集成电路布线技术》对我而言,更像是一份对集成电路产业发展脉络的深入解读。它在讲解技术细节的同时,也巧妙地融入了行业发展的历史和趋势。书中对于新兴布线技术,比如三维集成电路布线、先进封装技术下的布线挑战等前瞻性内容的探讨,让我对未来的 IC 设计充满了期待。我特别喜欢其中关于设计约束管理和可制造性设计(DFM)的章节,这部分内容详细阐述了如何在设计初期就考虑生产制造的可行性,从而避免在后期出现难以解决的问题。作者通过大量的实例,展示了如何根据不同的工艺制程和设计目标,选择最合适的布线策略。这本书不仅仅是技术手册,更像是一本行业百科全书,让我能够站在更高的视角,去理解超大规模集成电路布线技术的演进和未来发展方向。它让我意识到,这个领域的发展是日新月异的,需要不断学习和掌握新的知识和技术。

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这本《超大规模集成电路布线技术》给我带来的,是一种前所未有的“结构化思维”训练。它并非枯燥的技术术语堆砌,而是以一种系统化的方式,引导读者去理解芯片内部庞大而精密的“网络”是如何构建起来的。书中对各种布线工具和EDA(电子设计自动化)软件的原理性介绍,让我对这些强大的辅助工具有了更深的认识,明白它们并非万能,而是需要工程师具备扎实的理论基础才能发挥最大效用。我尤其喜欢书中关于物理验证和时序收敛的章节,这部分内容详细阐述了在实际流片过程中,如何通过反复的检查和优化,来确保芯片的性能达到设计目标。它让我明白,一个成功的芯片设计,是设计、布线、验证等各个环节协同作用的结果。作者通过大量的图例和流程图,将复杂的布线流程可视化,使得读者能够清晰地把握每一个步骤的逻辑和目标。这本书的价值在于,它不仅仅教你如何“画线”,更教你如何“思考”,如何从宏观到微观,一步步构建起满足复杂需求的集成电路。

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这本书就像是一本给工程师的“圣经”,对于想要在IC设计领域深耕的人来说,绝对是不可或缺的宝藏。它并没有停留于表面的介绍,而是非常深入地探讨了超大规模集成电路布线领域中的核心难题和前沿技术。我印象最深的是关于电源完整性(PI)和信号完整性(SI)的分析部分,这不仅仅是理论上的阐述,更包含了大量的仿真技巧和实际遇到的问题解决方案。书中详细介绍了各种潜在的信号干扰源,比如串扰、地弹、电源噪声等,以及如何通过精巧的布线策略来规避这些问题。而且,它还讲解了在高速数字电路和模拟电路中,布线设计所面临的独特挑战,并提供了切实可行的优化方法。我特别欣赏作者在讨论先进工艺节点下的布线技术时,对寄生效应的深入剖析,这对于理解当今高性能芯片的设计至关重要。这本书不仅仅是技术资料的堆砌,更体现了作者丰富的实践经验和深厚的理论功底。它让我在面对复杂的布线问题时,不再感到束手无策,而是能够从容地分析原因,并找到最优的解决方案。

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一本让我彻底拓宽了视野的工业巨著!我一直对电子产品的“幕后英雄”——那些微小的、纵横交错的电路布线——充满好奇,但市面上真正深入浅出的技术书籍却寥寥无几。直到我翻开这本《超大规模集成电路布线技术》,才算真正拨开了迷雾。从最基础的布线规则和设计流程讲起,作者用一种极其耐心且条理清晰的方式,将复杂的概念层层剥开。我特别喜欢书中关于时序约束和信号完整性处理的章节,虽然听起来很专业,但通过丰富的图示和具体的案例分析,即使是我这样的初学者也能理解其中的精髓。它不仅仅是讲解了“怎么做”,更深入探讨了“为什么这么做”,让我理解了每一个设计决策背后的考量和权衡。书中对不同布线算法的比较分析也让我大开眼界,原来在看似简单的线条背后,隐藏着如此多的优化和智慧。读完这本书,我感觉自己对芯片的理解已经上升到了一个全新的维度,仿佛能看到那些电子在内部奔腾的轨迹,充满了敬畏感。它让我明白,每一个微小的电子元件,都承载着工程师们无数的心血和智慧。

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这是一本能够点燃你对微观世界探索欲望的奇书。在翻阅之前,我对“布线”的理解可能还停留在电线连接电器那么简单,但这本书彻底颠覆了我的认知。它将布线技术提升到了艺术和科学的高度,展示了如何在一个方寸大小的芯片上,实现数以亿计的晶体管之间的精密连接。书中关于功耗和热量的布线考量,让我意识到,除了性能,工程师们还需要在有限的空间内,处理好能源的利用和散热问题。我特别欣赏书中对不同布线算法的详尽描述,比如从网格布线到全局布线再到详细布线,每一步都有其独特的优化目标和面临的挑战。作者通过鲜活的案例,揭示了这些算法在实际应用中的巧妙之处,以及它们如何影响芯片的最终性能和功耗。这本书让我明白了,每一个微小的电流路径,都经过了精密的计算和优化,其背后凝聚了无数工程师的智慧和汗水。读完它,我感觉自己仿佛拥有了一双能够“看见”芯片内部运作的眼睛。

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